Integrated circuit package and method of manufacture thereof

ABSTRACT

An integrated circuit (IC) package  100  comprises an IC  102  and leads  104  coupled to the IC. Each lead has a first end  106  configured to be coupled to the integrated circuit and a second end  108  configured to pass through one of a plurality of mounting holes  110  extending through a mounting board  112 . The leads comprise at least one positioning lead  114  comprising a stop  118  being a continuous part of the positioning lead and having a lateral dimension  120  greater than a diameter  122  of a first hole  124  of the plurality of mounting holes. The leads further comprise at least one non-positioning lead  116  having a continuous uniformly shaped body  130  with a lateral dimension  132  less than a diameter  134  of a second hole  136  of the plurality of mounting holes. The stop limits an extension of the non-positioning lead through the second hole.

TECHNICAL FIELD OF THE INVENTION

The present invention is directed to integrated circuit packaging and a method for manufacturing an integrated circuit package.

BACKGROUND OF THE INVENTION

After the manufacture of integrated circuits on a semiconductor wafer there remains the need to protect the individual integrated circuit dies from damage and to provide connections to other devices. The enclosure surrounding and connections to the integrated circuit is referred to as an integrated circuit package. Numerous consumer electrical products demand integrated circuit packages that are subject to high cost constraints. As integrated circuits grow in complexity and capabilities, however, conventional integrated circuit packages have inadequate thermal management and connectivity requirements. Additionally, today's complex integrated circuits are highly susceptible to damage by mechanical stresses that can be imparted from the surface that the integrated circuit package is mounted on.

Accordingly, what is needed in the art is an integrated circuit package that allows a large number of connections to the integrated circuit, facilitate heat transfer away from the integrated circuit, and protect the integrated circuit from mechanical stresses.

SUMMARY OF THE INVENTION

To address the above-discussed deficiencies of the prior art, the present invention provides in one embodiment, an integrated circuit package. The integrated circuit package comprises an integrated circuit and leads coupled to the integrated circuit. Each of the leads have a first end configured to be coupled to the integrated circuit and a second end configured to pass through one of a plurality of mounting holes extending through a mounting board. The leads comprise at least one positioning lead comprising a stop being a continuous part of the positioning lead and having a lateral dimension greater than a diameter of a first hole of the plurality of mounting holes. The leads further comprise at least one non-positioning lead having a continuous uniformly shaped body with a lateral dimension less than a diameter of a second hole of the plurality of mounting holes. The stop limits an extension of the non-positioning lead through the second hole.

Another aspect of the present invention is a method of manufacturing an integrated circuit package. The method comprises forming a plurality of leads. Each of said leads having first and second ends configured as described above. Forming the plurality of leads includes forming positioning and non-positioning leads configured as described above.

The foregoing has outlined preferred and alternative features of the present invention so that those skilled in the art may better understand the detailed description of the invention that follows. Additional features of the invention will be described hereinafter that form the subject of the claims of the invention. Those skilled in the art should appreciate that they can readily use the disclosed conception and specific embodiments as a basis for designing or modifying other structures for carrying out the same purposes of the present invention. Those skilled in the art should also realize that such equivalent constructions do not depart from the scope of the invention.

BRIEF DESCRIPTION OF THE DRAWINGS

For a more complete understanding of the present invention, reference is now made to the following detailed description taken in conjunction with the accompanying FIGUREs. It is emphasized that various features may not be drawn to scale. In fact, the dimensions of various features may be arbitrarily increased or reduced for clarity of discussion. In addition, it is emphasized that some circuit components may not be illustrated for clarity of discussion. Reference is now made to the following descriptions taken in conjunction with the accompanying drawings, in which:

FIG. 1 illustrates a perspective view of one embodiment of an integrated circuit package of the present invention;

FIG. 2 presents a plan view of exemplary integrated circuit package of the present invention;

FIG. 3 presents a plan view of another embodiment of the integrated circuit package of the present invention;

FIGS. 4-8 illustrate plan views of selected steps in an exemplary method of manufacturing an integrated circuit package following the principles of the present invention; and

FIGS. 9-13 illustrate plan views of selected steps in an alternative method of manufacturing an integrated circuit package of the present invention.

DETAILED DESCRIPTION

FIG. 1 presents a perspective view of one embodiment of the present invention, an integrated circuit package 100. The integrated circuit package 100 comprises an integrated circuit 102 and leads 104 coupled to the integrated circuit 102. The integrated circuit 102 can comprise any conventional microelectronic device, such as standard linear and logic products, digital signal processors, microprocessors, digital and analog devices, high frequency and higher power devices, and comprise either large or small chip sizes.

Each of the leads 104 have a first end 106 configured to be coupled to the integrated circuit 102 and a second end 108 configured to pass through one of a plurality of mounting holes 110 extending through a mounting board 112. The leads 104 comprise at least one positioning lead 114 and at least one non-positioning lead 116. The positioning lead 114 comprises a stop 118. The stop 118 is a continuous part of the positioning lead 114 and has a lateral dimension 120 that is greater than a diameter 122 of a first hole 124 of the plurality of mounting holes 110. The term lateral dimension 120 as used herein refers to any number of directions 126, 127 that is parallel with a plane 128 of the mounting board 112. The non-positioning lead 116 has a continuous uniformly shaped body 130 with a lateral dimension 132 less than a diameter 134 of a second hole 136 of the plurality of mounting holes 110. The stop 118 limits an extension of the non-positioning lead 116 through the second hole 136.

The first ends 106 of the leads 104 can be configured for direct or indirect coupling to the integrated circuit 102. For the embodiment shown in FIG. 1, bonding wires 138 facilitate the indirect coupling of the first ends 106 of the leads 104 to bond pads 140 on the integrated circuit 105. Of course, direct coupling by placing the first ends 106 in contact with the bond pads 140 is also within the scope of the present invention. Similarly, the second ends 108 of the leads 104 can be coupled directly or indirectly to metal lines 142 of a printed circuit 144. For instance, as shown in FIG. 1, the second ends 108 of both the positioning lead 114 and non-positioning lead 116 are directly coupled via solder to the metal lines 142 of the printed circuit 144. For the embodiment shown in FIG. 1, the metal lines 142 are patterned on a bottom side 146 of the mounting board 112, whereas the integrated circuit package 100 is surface mounted on a topside 148 of the mounting board 112

With continuing reference to FIG. 1, the integrated circuit package 100 can further comprise a mold 150, a heat sink 152 and a mounting pad 154. In preferred embodiments the integrated circuit 102 is coupled to the mounting pad 154 using an adhesive such as epoxy. The mold 150, which can also be made of an epoxy, encompasses the integrated circuit 102. In addition to protecting the integrated circuit 102 against harmful environmental conditions, the mold 150 securely holds the leads 104, bond wire 138 and heat sink 152 at appropriate locations relative to the integrated circuit 102. For instance, the first end 106 of the leads 104 is encompassed by the mold 150, and at least a portion of the heat sink 152 is surrounded by the mold 150.

In some preferred embodiments, such as shown in FIG. 1, the mold 150 holds the heat sink 152 above a top surface 156 of the integrated circuit 102. Locating the heat sink 152 over the integrated circuit 102 is advantageous in embodiments where the integrated circuit package 100 is held above the plane 128 of the mounting board 112 and the heat sink 152 does not contact the mounting board 112. In these cases, there is greater dissipation of heat generated from the active integrated circuit 102 as compared to a heat sink that is under the integrated circuit 102.

The stop 118 of the positioning lead 114 is configured to hold the integrated circuit package 100 above the plane 128 of the mounting board 112 by a fixed distance 158, for example, about 100 microns to about 2000 microns. Holding the integrated circuit package 100 above the plane 128 of the mounting board 112 advantageously protects the integrated circuit 102 against damage from mechanical stresses that can otherwise be imparted from the mounting board 112 to the integrated circuit package 100. Preferably, the stop 118 is configured to prevent a segment 160 of the positioning lead 114 from passing through the first hole 124. As illustrated in FIG. 1, the segment 160 is between the first end 106 and the stop 118.

The stop can be configured to have a number of different shapes to provide the lateral dimension greater than the diameter of its corresponding mounting hole. For example, as illustrated in FIG. 1, the stop 118 of the positioning lead 114 comprises an increased width 162 in one direction 126. In some preferred embodiments, the increase width 162 is at least about 5 percent greater than the diameter 122 of the first hole 124. Of course, other configurations where the increased width is in a different direction 127, or several directions that are parallel to the plane of the mounting board 112, are also within the scope of the present invention.

As another example, the positioning lead can have a stop that comprises a bend in the positioning lead. For instances, FIG. 1 shows a second positioning lead 164 having a stop 166 that comprises a bend in the second positioning lead 164. In some preferred embodiments, the stop 166 has an interior angle 168 ranging from about 70 to about 110 degrees, although other ranges of angles and type types of bends can be used. Of course, positioning lead having stops that comprise multiple bends, or both and increased width and a bend are also within the scope of the present invention.

With continuing reference to FIG. 1, to present additional aspects of the present invention, FIG. 2 presents a plan view of exemplary integrated circuit package 200. The same reference numbers used in FIG. 1 are used to label analogous components of the integrated circuit package 200. For clarity, the leads 104 and mold 150 are depicted as being semitransparent and transparent, respectively.

As shown in FIG. 2, to hold the integrated circuit package 200 above the plane 128 of the mounting board 112, it is preferable to have at least two positioning leads 205, 210. In some cases, such as shown in FIG. 1, the positioning leads 114, 164 are coupled to the same side of the integrated circuit 102. It is more preferable, however, for the two positioning leads 205, 210 to be coupled to opposing sides of the integrated circuit 102, as shown in FIG. 2. Locating the positioning leads 205, 210 on opposing sides of the integrated circuit 102 more stably holds the integrated circuit package 100 at the fixed distance 158, as compared to having positioning leads on only one side of the integrated circuit 102. Configuring the two positioning leads 205, 210 as corner leads, such as shown in FIG. 2, is even more desirable, as this configuration further stabilizes the seating of the integrated circuit package 200 on the mounting board 112. Additional stability can be gain by locating the corner positioning leads 205, 210 in opposing diagonal corners of the integrated circuit 102, such as shown in FIG. 2.

In some instances, configuring the positioning leads 205, 210 as corner leads provides the additional benefit of reducing the pitch 215 between the corner positioning lead 210 and an adjacent interior non-positioning lead 220. Reducing the pitch 215 between the corner positioning lead 210 and the adjacent interior non-positioning lead 220 is facilitated by locating the stop 118 on a side of the positioning lead 210 that is non-proximal to the adjacent non-positioning lead 220, as shown in FIG. 2.

Corner positioning leads 205, 210 can be advantageously used in combination with a variety of surface mounting configurations to reduce the interior lead pitch 225 and thereby increase the number of connections to the integrated circuit 102. For instance, as shown in FIG. 2, the interior non-positioning leads 230 are extended through mounting holes 110 that are arranged in a staggered configuration. In some cases, to facilitate extension of leads 104 through the staggered mounting holes 110, shorter non-positioning leads 235 are interleaved with longer non-positioning leads 240 on the same side of the integrated circuit 102. Of course, short and long positioning leads 205, 210 can also be using in a staggered hole configuration.

With continuing reference to FIG. 1, FIG. 3 presents a plan view of another embodiment of the integrated circuit package 300 of the present invention. Again, the same reference numbers as used in FIG. 1 are used to label analogous components of the integrated circuit package 300. FIG. 3 presents a preferred embodiment of the integrated circuit package comprising at least four positioning leads 305, 310, 315, 320. Preferably, the positioning leads 305, 310, 315, 320 are corner leads, where each one of the positioning leads 305, 310, 315, 320 are coupled to different corners of the integrated circuit 102. FIG. 3 illustrates the positioning leads 305, 310, 315, 320 and non-positioning leads 325 being extended, below the plane of view, through mounting holes 110 that are arranged in a straight-line configuration. Of course, a staggered arrangement of mounting holes 110, similar to that presented in FIG. 2 could also be used.

For clarity, only a limited number of leads 104 are depicted in the embodiments of the integrated circuit packages illustrated in FIGS. 1-3. It should be understood, however, that the integrated circuit package of the present invention could contain any number of leads found in a conventional surface-mount integrated circuit packages. For instance, integrated circuit packages having from two to three hundred leads are known in the industry. Also, the integrated circuit package can be any number of conventional type of lead-containing package, including plastic dual in-line integrated circuit packages (PDIP), small outline integrated circuits (SOICs), quad flat packages (QFPs), thin QFPs (TQFPs), Small Shrink Outline Plastic packages (SSOP), thin SSOPs (TSSOPs), thin very small-outline packages (TVSOPs), or other packages known to those skilled in the art. The leads can be made of any conventional ductile conductive material used for through-hole leads. Non-limiting examples of such materials include gold, silver, copper and alloys thereof. In some cases, the leads are plated with tin, nickel, palladium or similar materials to improved adhesion to solder.

Another aspect of the present invention is a method of manufacturing an integrated circuit package. The method of manufacturing an integrated circuit package can be used to produce any of the embodiments of the integrated circuit package presented in FIGS. 1-3 and discussed above.

FIGS. 4-8 illustrate plan views of selected steps in an exemplary method of manufacturing an integrated circuit package 400 following the principles of the present invention. Turning first to FIG. 4, presented is a plan view of a partially completed integrated circuit package 400 after forming a layout pattern 405 on a metal sheet 410. Any conventional process, such as photolithography can be used to define the layout pattern 405 on the metal sheet 410. The layout pattern 405 comprises a lead layout pattern 415 for at least one positioning lead having a stop.

With continuing reference to FIG. 4, FIG. 5 shows the partially completed integrated circuit package 400 after removing portions of the metal sheet 410 that are outside of the layout pattern 405 to thereby form a lead frame 505 comprising at least one positioning lead segment 510 having a stop 515. As illustrated in FIG. 5, the stop 515 is configured to be a continuous part of the positioning lead segment 510. Any conventional method, such as stamping or etching, can be used to form the leads frame 505 out of the sheet of metal 415. The lead frame 505 further comprises a one or more non-positioning lead segments 520 and pad 525 configured to accommodate an integrated circuit. Although not shown for the sake of clarity, one of ordinary skill in the art would understand that the lead frame 505 can also include other conventional components, such as shorting bars, dam bars, etc. . . . , to facilitate forming the integrated circuit package 400.

With continuing reference to FIGS. 4-5, FIG. 6 presents the integrated circuit package 400 after coupling an integrated circuit 605 to the pad 525, coupling a heat sink 610 to the integrated circuit 605, and coupling the positioning lead segments 510 and non-positioning lead segments 520 to the integrated circuit 520. Similar to that discussed above in the context of FIG. 1, both direct coupling, or indirect coupling via bonding wires 615, are within the scope of the invention.

With continuing reference to FIGS. 4-6, FIG. 7 show the partially completed integrated circuit package 400 after removing portions of the lead frame 505 to thereby form a plurality of leads 705 comprising positioning leads 710 having a stop 715 and non-positioning leads 720. Any conventional device such as a trimmer tool can be used to remove the undesired portions of the lead frame. Each of the leads 705 has a first end 725 and a second end 730, the first end 725 being coupled to the integrated circuit 605.

FIG. 7 also illustrates the partially completed integrated circuit package 400 after enclosing the integrated circuit 605 in a mold 740. For clarity, a transparent view through the mold 740 is presented. Preferably, the mold 740 also encloses the first end 725 of the each of leads 705. As shown in FIG. 7, in some cases it is advantageous for one or more of the positioning leads 710 to be left attached to the lead frame 505 shown in FIG. 5, while the non-positioning leads 715 are isolated from the lead frame 505. In such instances, the positioning lead segment 510 and positioning lead 710 are substantially the same structures. Of course, any combination of leads 705 that are each attached or isolated from the lead frame 505 is also within the scope of the present invention.

With continuing reference to FIGS. 4-7, FIG. 8 shows the completed integrated circuit package 400 after bending the leads 705, below the plane of view, and mounting the integrated circuit package to a mounting board 805 having a plurality of mounting holes 810. Any conventional device such as a bending tool can be used to bend the leads 705. The leads 705 are bent below the plane of view to configure the second ends of the leads 730 shown in FIG. 7 to pass through the mounting holes 810 and thereby extend the second ends 730 through the mounting board 805. Preferably, the positioning lead 710 is bent to configure the stop 715 to be below a bottom surface of the mold 740. In some preferred embodiments, the plurality of mounting holes 810 all have substantially a same diameter 815, although embodiments with differently-sized mounting holes are also within the scope of the present invention.

The stop 715 of the positioning leads 710 is configured to have a lateral dimension 820 greater than the diameter 815 of a first hole 825. The stop 715 thereby limits an extension of at least one non-positioning lead 720 through a second hole 830 of the mounting holes 810. Moreover, because the stop 715 is a continuous part of the positioning lead 710, the stop 715 is less prone to deform, break or shear off while the integrated circuit package is being mounted or in use, as compared to a stop that is mechanically attached or bonded to the positioning lead 710. Returning to FIG. 7, the stop 715 of the positioning lead 710 is also configured to have a width 745 greater than a width 750 that of an adjacent portion 755 of the positioning lead. The adjacent portion 755 is configured to pass through the first hole 825 shown in FIG. 8.

For the embodiment presented in FIGS. 4-8, the properties of the positioning lead 710 requires that the method include the preparation of a layout pattern 405, shown in FIG. 4, to have a special lead layout pattern 415 for the positioning lead to define a stop. In other embodiments of the method, however, the layout pattern does not have a special lead layout pattern.

Such an embodiment is illustrated in FIGS. 9-13, which present plan views of selected steps for an alternative exemplary method of manufacturing an integrated circuit package 900 according to the present invention. Turning first to FIG. 9, illustrated is a plan view of a partially completed integrated circuit package 900 after forming a layout pattern 905 on a metal sheet 910. The layout pattern 905 comprises a lead layout pattern 915 for a plurality of uniformly shaped leads. Unlike the embodiment presented in FIGS. 4-8, however, there is no special pattern for a positioning lead having a stop.

With continuing reference to FIG. 9, as illustrated in FIG. 10, portions of the metal sheet 910 outside of the layout pattern 905 can be removed, using the same procedures as discussed in the context of FIG. 5, to provide a lead frame 1005. The lead frame 1005 comprises lead segments 1010 that are uniformly shaped.

While maintaining reference to FIG. 9-10, FIG. 11 shows the partially completed integrated circuit package 900 after adding an integrated circuit 1105, heat sink 1110, and bonding wiring 1115 to the integrated circuit package 900 using the same procedures as discussed in the context of FIG. 6. Similarly, portions of the lead frame 1005 can be removed to form a plurality of uniformly-shaped leads 1120 having first and second ends 1125, 1130, and a mold 1140 applied to enclose the integrated circuit 1105, using the same procedures discussed in the context of FIG. 7. As illustrated in FIG. 11, however, all of the leads 1120 at this stage in the manufacturing process are substantially identical and uniformly shaped.

With continuing reference to FIG. 9-11, FIG. 12 shows the partially completed integrated circuit package 900 after forming at least one positioning lead 1210 by bending at least one of the uniformly-shaped leads 1120 shown in FIG. 11 to form a stop 1215. In this embodiment, the stop 1215 is a bend in the positioning lead 1210. Leads 1120 that are not bent in this fashion are non-positioning leads 1220. As noted above, configuring the stop 1215 as a continuous part of the positioning lead 1210, makes the stop 1215 resistant to deformation, breaking or shearing off while the integrated circuit package 900 is being mounted or in use.

While still referring to FIG. 9-12, FIG. 13 shows the integrated circuit package 900, after additional bending of the positioning leads 1210, and for the first time, bending of the non-positioning leads 1220, to situate their second ends 1130, shown in FIG. 12, below the plane of view. The integrated circuit package 900 is shown after coupling to a mounting board 1305, having a plurality of holes 1310. Similar to previously discussed embodiments, the stop 1215 of the positioning lead 1210 is configured to have a lateral dimension 1315 that greater than a diameter 1320 of a first hole 1325. The stop 1210 thereby limits an extension of one or more non-positioning leads 1220 through a second hole 1330.

For clarity, the manufacture of the integrated circuit packages shown in FIGS. 4-8 and 9-13 are shown as separate process flows. However, one skilled in the art would recognize that these processes could be combined into a single process flow, if desired.

Although the present invention has been described in detail, those skilled in the art should understand that they could make various changes, substitutions and alterations herein without departing from the scope of the invention in its broadest form. 

1. An integrated circuit package, comprising: an integrated circuit; and leads coupled to said integrated circuit, each of said leads having a first end configured to be coupled to said integrated circuit and a second end configured to pass through one of a plurality of mounting holes extending through a mounting board, and wherein said leads comprise: one or more positioning lead comprising a stop being a continuous part of said positioning lead and having a lateral dimension greater than a diameter of a first hole of said plurality of mounting holes, and one or more non-positioning lead having a continuous uniformly shaped body with a lateral dimension less than a diameter of a second hole of said plurality of mounting holes, wherein said stop limits an extension of said non-positioning lead through said second hole.
 2. The integrated circuit package as recited in claim 1, further comprises a mold encompassing said integrated circuit and holding a heat sink above a top surface of said integrated circuit.
 3. The integrated circuit package as recited in claim 1, further comprises a mold encompassing said integrated circuit, wherein said first end is encompassed by said mold and at least a portion of said stop is below a bottom surface of said mold.
 4. The integrated circuit package as recited in claim 3, wherein said stop is configured to hold said bottom surface above said mounting board by a fixed distance.
 5. The integrated circuit package as recited in claim 1, wherein said stop is configured to prevent a segment of said positioning lead from passing through said first hole, said segment being between said first end and said stop.
 6. The integrated circuit package as recited in claim 1, wherein said stop comprises a bend in said positioning lead.
 7. The integrated circuit package as recited in claim 6, wherein said bend has an interior angle ranging from about 70 to about 110 degrees.
 8. The integrated circuit package as recited in claim 1, wherein said stop comprises an increased width in said positioning lead.
 9. The integrated circuit package as recited in claim 8, wherein said increased width is at least about 5 percent greater than said diameter of said first hole.
 10. The integrated circuit package as recited in claim 1, further comprises at least two of said positioning leads, wherein said positioning leads are corner leads being coupled to opposing corners of said integrated circuit.
 11. The integrated circuit package as recited in claim 1, further comprises at least four of said positioning leads, wherein said positioning leads are corner leads each one of said positioning leads being coupled to different corners of said integrated circuit.
 12. The integrated circuit package as recited in claim 1, wherein said stop is located on a side of said positioning lead that is non-proximal to an adjacent non-positioning lead.
 13. The integrated circuit package as recited in claim 1, wherein said non-positioning lead comprises short non-positioning leads interleaved with long non-positioning leads, both said short and long non-positioning leads being coupled to a same side of said integrated circuit.
 14. A method of manufacturing an integrated circuit package, comprising: forming a plurality of leads, each of said leads having a first end configured to be coupled to an integrated circuit and a second end configured to pass through one of a plurality of holes extending through a mounting board, including: forming a positioning lead comprising a stop being a continuous part of said positioning lead and having a lateral dimension greater than a diameter of a first hole of said plurality of mounting holes; and forming a non-positioning lead having a continuous uniformly shaped body having a lateral dimension less than a diameter of a second hole of said plurality of mounting holes, wherein said stop limits an extension of said non-positioning lead through said second hole.
 15. The method recited in claim 14, wherein forming said positioning lead comprises: forming a layout pattern on a metal sheet, wherein said layout pattern comprises a lead layout pattern for said least one positioning lead having said stop; and removing portions of said metal sheet that are outside of said layout pattern to thereby form a lead frame comprising said at least one positioning lead.
 16. The method as recited in claim 15, wherein said stop comprises a width greater than that of an adjacent portion of said positioning lead, said adjacent portion being configured to pass through said first hole.
 17. The method of fabrication recited in claim 14, wherein forming said positioning lead comprises: forming a lead layout pattern on a metal sheet, wherein said layout pattern comprises a lead layout pattern for a plurality of uniformly shaped leads; removing portions of said metal sheet that are outside of said layout pattern to thereby form said leads that are uniformly-shaped leads; and bending at least one of said uniformly shaped leads to form said positioning lead comprising said stop.
 18. The method as recited in claim 17, wherein said stop comprises a bend with an interior angle ranging from about 70 to about 110 degrees.
 19. The method as recited in claim 14, further includes bending said positioning lead to configure said stop to be below a bottom surface of a mold encompassing said integrated circuit.
 20. The method as recited in claim 14, further comprising coupling a heat sink to a top surface of said integrated circuit; and encompassing said integrated circuit in a mold. 